Part No
Brand
Specification
MPQ|MOQ
Quantity
US Dollar
Delivery Date
Operation
Boyd
Batch：2333
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 31.9°C/W Black Anodized
MPQ:1
MOQ:58
58+
$1.69048
11-13 Days
Boyd
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 31.9°C/W Black Anodized
MPQ:1
MOQ:58
58+
$1.69048
11-14 Days
Boyd
Batch：2333
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 31.9°C/W Black Anodized
MPQ:1
MOQ:58
58+
$1.69048
9-12 Days
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