Part No
Brand
Specification
MPQ|MOQ
Quantity
US Dollar
Delivery Date
Operation
Boyd
Batch：2219
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 30.6°C/W Black Anodized
MPQ:1
MOQ:1
1+
$1.9393
11-13 Days
Boyd
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 30.6°C/W Black Anodized
MPQ:1
MOQ:4
4+
$1.9393
11-14 Days
Boyd
Batch：2219
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 30.6°C/W Black Anodized
MPQ:1
MOQ:5
5+
$1.9393
9-12 Days
Inquiry
| Part No | Quantity | Manufacturer |
|---|---|---|
Please provide following contact information.
Company Name:
Contact Name:
Tel:
E-mail:
Message:
Verification: