Part No
Brand
Specification
MPQ|MOQ
Quantity
US Dollar
Delivery Date
Operation
Boyd
Batch：2022
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 23.4°C/W Black Anodized
MPQ:1
MOQ:1314
1314+
$1.91961
11-13 Days
Boyd
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 23.4°C/W Black Anodized
MPQ:1
MOQ:1314
1314+
$1.91961
11-14 Days
Boyd
Batch：2022
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 23.4°C/W Black Anodized
MPQ:1
MOQ:1314
1314+
$1.91961
9-12 Days
Boyd
散热片 BGA Aluminum 1.5W @ 40°C Top Mount
MPQ:510
MOQ:1
1+
$4.8168
510+
$4.0932
1020+
$3.2184
More
13-15 Days
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