Part No
Brand
Specification
MPQ|MOQ
Quantity
US Dollar
Delivery Date
Operation
Boyd
Batch：2450
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 23.4°C/W Black Anodized
MPQ:1
MOQ:19
19+
$3.21332
11-13 Days
Boyd
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 23.4°C/W Black Anodized
MPQ:1
MOQ:19
19+
$3.21332
11-14 Days
Boyd
Batch：2450
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 23.4°C/W Black Anodized
MPQ:1
MOQ:19
19+
$3.21332
9-12 Days
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