Part No
Brand
Specification
MPQ|MOQ
Quantity
US Dollar
Delivery Date
Operation
Boyd
Batch：2510
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3°C/W Black Anodized
MPQ:168
MOQ:840
840+
$3.6876
1008+
$3.67185
2520+
$3.3663
7-10 Days
Boyd
Batch：2229
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3°C/W Black Anodized
MPQ:1
MOQ:32
32+
$3.4738
11-14 Days
Boyd
Batch：2229
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3°C/W Black Anodized
MPQ:1
MOQ:32
32+
$3.4738
11-13 Days
Boyd
Heat Sink BGA Aluminum 3.0W @ 50°C Top Mount
MPQ:168
MOQ:1
1+
$5.8644
10+
$5.7024
25+
$4.3524
More
13-15 Days
Boyd
Batch：2510
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3°C/W Black Anodized
MPQ:840
MOQ:840
840+
$5.23864
9-12 Days
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