Part No
Brand
Specification
MPQ|MOQ
Quantity
US Dollar
Delivery Date
Operation
Boyd
Batch：2440
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
MPQ:1
MOQ:6720
6720+
$0.91224
10080+
$0.90247
7-10 Days
Boyd
Batch：2352
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
MPQ:1
MOQ:6
6+
$1.25004
9-12 Days
Boyd
Batch：2440
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
MPQ:1
MOQ:6
6+
$1.83799
9-12 Days
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