374724B00035G

In stock
- 374724B00035G Details
- Packing And Shipping
- Payment Method
- Quality Control
Specification
Termination type | Adhesive |
Package | 35 mm*35 mm*18 mm |
工厂最小包装 | 670 |
寿命周期 | 量产 |
ROHS | no |
Brand | Aavid |
Length | 35 mm |
Width | 35 mm |
Height | 18 mm |
Others include "374724B00035G" parts
The following parts include '374724B00035G'
374724B00035G Releted Information
- Popular Products
FEATURED PRODUCT SOMRON
-
-
-
43-77-1G
Boyd
Thrml Mgmt Access Thermal Insulator Amber 0.156Wm/K 1017Ohm.cm Polyamide/Plastic
Learn More >
-
-
-
-
371824B00032G
Boyd
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 31.9°C/W Black Anodized
Learn More >
-
-
-
-
374624B00035G
Boyd
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 23.4°C/W Black Anodized
Learn More >
-
-
-
-
374624B00032G
Boyd
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 23.4°C/W Black Anodized
Learn More >
-
-
-
-
374824B60024G
Boyd
Heat Sink Passive BGA Pin Array Clip Aluminum 12°C/W Black Anodized
Learn More >
-
-
-
-
4169G
Boyd
Thermally Conductive Gap Thermal Pads
Learn More >
-
-
-
-
375424B00034G
Boyd
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
Learn More >
-
-
-
-
375124B60024G
Boyd
Heat Sink Passive BGA Pin Array Clip Aluminum 10.3°C/W Black Anodized
Learn More >
-
-
-
-
4860
Boyd
Mounting Kits, Thermal Film
Learn More >
-
-
-
-
4880SG
Boyd
Thermally Conductive Gap Thermal Pads
Learn More >
-
-
View All Newest Products from Omron