Part No
Brand
Specification
MPQ|MOQ
Quantity
US Dollar
Delivery Date
Operation
Boyd
Batch：1342
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3°C/W Black Anodized
MPQ:1
MOQ:96
96+
$2.9381
11-13 Days
Boyd
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3°C/W Black Anodized
MPQ:1
MOQ:96
96+
$2.9381
11-14 Days
Boyd
Batch：1342
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3°C/W Black Anodized
MPQ:1
MOQ:96
96+
$2.9381
9-12 Days
Boyd
Heat Sink BGA Aluminum 3.0W @ 50°C Top Mount
MPQ:672
MOQ:1
1+
$6.6096
672+
$4.3956
13-15 Days
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